Cellecta HiDECK Structural Overlay 30 - 30mm x 600mm x 1200mm

• Excellent acoustic and fire performance
• Low thermal resistance, ideal for underfloor heating (UFH) systems
• Proprietary floorboard approved for Robust Details FFT1, 2 & 3
• Provides the appearance and feel of a traditional screed
• Compatible with various floor types, including steel, concrete, and timber
• Bearing spacing = 45mm wide

Residential, commercial, and industrial buildings: Cellecta HiDeck 30 is ideal for use in residential, commercial, and industrial buildings for floor constructions that require both structural strength and sound insulation. Its composition provides the necessary rigidity and durability for handling heavy loads, making it suitable for high-traffic areas in commercial and industrial settings. At the same time, HiDeck 30 delivers excellent acoustic performance, reducing both impact and airborne noise between floors. This dual functionality makes it a practical solution in environments where strength and sound control are essential, such as apartments, offices, and industrial buildings.

• What is Cellecta HiDeck 30? - Cellecta HiDeck 30 is a high-density, tongue-and-groove composite flooring board designed to provide excellent acoustic performance in separating floors. It is suitable for use in both new builds and refurbishment projects.
• How does Cellecta HiDeck 30 improve sound insulation? - HiDeck 30 reduces both impact and airborne sound transmission between floors. Its high-density design helps absorb noise, making it ideal for creating quieter living or working environments.
• Can Cellecta HiDeck 30 be used with underfloor heating systems? - Yes, HiDeck 30 is compatible with underfloor heating systems, providing structural integrity and acoustic insulation without interfering with heat transmission.
• How is Cellecta HiDeck 30 installed? - HiDeck 30 is installed using its tongue-and-groove design for easy and secure fitting. It can be laid directly over joists or existing floors, ensuring a smooth and efficient installation process.